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Industry News

Rogers launches high frequency laminate material with improved thermal reliability for higher MOTs

May 30, 2013
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Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).

In 2010, Rogers Corp. launched its groundbreaking product, RO4360™ laminate, the first high Dk RF thermoset laminate. Rogers has now launched the next generation, RO4360G2 laminate, with improved thermal reliability that will help fabricators achieve higher UL MOT’s. With a tailored high Dk of 6.15 @ 10 GHz, this recently launched material allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size (20-30%). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B™ material.

UL 94V-0 flame rating (pending) and fully lead-free process capable, RO4360G2 laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.

Typical applications for RO4360G2 laminates are power amplifiers, LNAs, RF components (combiners/splitters), patch antennas, and as a replacement material for designs previously employing LTCC (low temperature, co-fired ceramic). RO4360G2 laminates are the material solution designers working on 4G and next generation defense/aerospace platforms have been looking for.

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