The Electronic Design Innovation Conference (EDI CON) debuted in Beijing, China on March 12-14th. You may have read some of the post-show news and reports that were sent out immediately following the event. By all accounts, it was a smashing success, exceeding even our most optimistic projections. The event drew nearly 2,500 attendees, more than 1,200 conference delegates and 22 media organizations. The Plenary session was completely full, many presentations were standing-room only and the exhibition was buzzing. Good stuff all-around.
We’re now deep in to the planning phase for the 2014 event. EDI CON will take place next April in Beijing, allowing us to leverage the extensive database we’ve compiled in that region and to build on the success of the initial event. The conference will continue to be "industry-driven," with experts presenting on a wide-range of topics that are at the forefront of current electronic design issues. The exhibition is expected to grow substantially, with additional companies eager to present their unique capabilities to the growing Chinese design engineering audience.
The MWJ team will be in Seattle in force, covering the latest news and product launches and providing marketing solutions for our clients needs. We’ll also be sharing details of next year’s EDI CON event. If you would like to arrange a meeting to learn more, please shoot me an email or stop by the MWJ booth (825) at your convenience.
For those of you heading to Seattle, I wish you safe travels and a productive and enjoyable Microwave Week.