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Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer’s representative Chalman Technologies in Anaheim, California.
The company will also offer expanded services for heavy wire and ribbon in addition to thin wire applications at its demonstration labs in Tempe, Arizona and Clinton, Massachusetts.
The BONDJET BJ939 heavy wire bonder is ideal for power electronics and automotive device applications. Key features and specifications include:
Aluminum, gold, silver and copper round or ribbon wire
3 mil to 20 mil wire
.075mm x .75mm to .3mm x 2mm ribbon on the same machine
Places up to 3 wires/sec
Integrated pull test
Large table travel
E-Box™ optical tool adjustment
PiQC™ Process-integrated Quality Control measures true bond quality in real time
In-air cut feature eliminates marking on die
In addition to providing demonstrations to customers, the company will offer early stage product development services on the BONDJET BJ939, including:
Heavy wire and ribbon bonding process support
Development and production of prototypes
Customers interested in heavy wire and ribbon bonding product development services should contact Michael McKeown with questions and to send samples for their applications. Mike is a wire and ribbon bonding process expert with nearly three decades of experience in the automotive and power electronics industries. He recently joined Hesse Mechatronics as senior business development manager and can be reached at firstname.lastname@example.org.
“We are very pleased to expand our heavy wire and ribbon bonding services to customers throughout the Americas,” notes Joseph S. Bubel, president of Hesse Mechatronics, Inc. “Our team is eager to put their expertise to work helping customers in the very early stages of new product development and support them through successful production.”
For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services, please e-mail email@example.com. To see wire bonding in action, visit www.wirebonddemo.com.
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