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Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its advanced printed circuit board (PCB) materials at the upcoming Del Mar Electronics & Design Show (www.vts.com/delmar).
This event is scheduled for May 1-2, 2013 at the Del Mar Fair Grounds in San Diego, CA. This show will feature electronic components and integrated circuits (ICs), manufacturing products and services, test equipment, and engineering software for the electronics, medical, and biotech industries. Representatives from Rogers Corporation’s Advanced Circuit Materials Division (www.rogerscorp.com/acm) will be available at Booth #622 to offer advice and guidance on the most effective use of their high performance PCB materials in analog, digital, and RF/microwave circuits, with samples of their next generation RO4000® high frequency laminates, 2929 bondply materials, and MCL-HE-679G/ THETA® high speed digital circuit materials.
Rogers’ next generation RO4000 materials, RO4835™ high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing a special level of electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. Just as with RO4350B material, RO4835 laminates offer a dielectric constant of 3.48 at 10 GHz, a low loss tangent of 0.0037 at 10 GHz, and a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions. These improved oxidation resistance circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard fabrication methods.
2929 bondply material is a thin adhesive film well suited to the design and fabrication of reliable multi-layer circuits in combination with high performance core materials, including Rogers RT/duroid®, RO3000® and RO4000 laminates. The unreinforced thermoset adhesive film is available in several thicknesses (1.5, 2, and 3 mil), and sheets can be stacked to achieve thicker adhesive layers as needed. It has a low dielectric constant of 2.94 and low dissipation factor of less than 0.003 at 10 GHz. This proprietary cross-linking resin system supports sequential lamination processing. The 2929 bondply material also features controlled flow characteristics for excellent blind via fill results.
Digital circuit designers can achieve high levels of performance with Rogers’ halogen-free MCL-HE-679G/THETA laminates and prepreg products. RoHS-compliant MCL-HE-679G/ THETA circuit materials boast minimal conductor and dielectric losses in support of superior signal-integrity (SI) performance. MCL-HE-679G/ THETA laminates exhibit a dielectric constant of 3.90 at 1 GHz, with low dissipation factor of 0.009 at 1 GHz. These laminates are engineered for high reliability over temperature, with a coefficient of thermal expansion (CTE) of only 50 ppm/°C in the z direction, which is about 30% lower than standard FR-4 circuit materials. Such CTE performance is directly related to improved reliability of PCB plated through holes (PTHs), buried, blind and stacked via structures in complex sequential lamination multilayer structures. MCL-HE-679G/ THETA circuit materials feature a high glass transition temperature (Tg) for high-yield, lead-free processing.
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