Substrates

Available in 99.5% purity levels, Tecdia Alumina Substrates excel in high-frequency applications. Custom patterned metallization thicknesses from 10nm to 8μm with lines as narrow as 10μm. Side metallization, thru holes, and via holes are also available.

Features:

  • Excellent thermal conductivity, electrical insulation, and physical strength characteristics
  • Plating available from 10nm to 8μm with resistive films also available
  • High purity (99.5%) reduces loss in high-frequency applications

Uses:

  • Input/output substrates for high-frequency devices
  • Submounts and relay boards for optical communications devices
  • Circuit boards for communication devices

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