UltraSource announces backside treatment for thin film epoxy adhesion
Michael Casper, president and CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
When bonding thin film components to carriers and housings with epoxy, the success of the application depends not only on the strength of the epoxy, but also on how well the epoxy adheres to the surface it is being applied to. The strength of the bond relies on the epoxy’s ability to mechanically “key” into clean, dry, mating surfaces.
UltraSource has developed a surface modification technique that provides a cross-hatched 3-5 micro inch surface finish that allows the epoxy to attach itself securely and key into the texture of the surface, therefore reducing delaminating and peeling issues. This method of attachment has proven to be effective with substrates attached to carriers or metal housings. UltraSource’s backside burnishing treatment is carefully controlled so that it textures the gold surface of the substrate but does not reduce the gold or reduce its thickness so electrical performance is unaffected.
Casper explained that “this surface treatment will often result in an improved adhesion and eliminate the need for customers to “roughen up” the surface of their components themselves – we’re saving our customers that time consuming step.”
Contact UltraSource for further information on this unique backside metallization process or to request samples so you can evaluate the process directly.