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The Electronic Design Innovation Conference (EDI CON) to be held in Beijing, China next month will offer engineers and researchers practical training and insight into the state of technology driving RF, microwave and high-speed component design and system integration. The conference program will emphasize measurement, simulation and semiconductor technologies that support electronic component design for high-frequency systems from telecommunications to satellite navigation. EDI CON will serve the industry by providing access to the knowledge and expertise that engineers need to meet tomorrow’s challenges.
The bulk of papers have been provided by companies at the forefront of our industry’s technical innovations. As a result, the conference reflects global trends at the device and system levels. To understand technology trends in the context of market opportunities, the opening day will feature keynote presentations from multiple business and engineering perspectives.
Peer-reviewed papers from industry experts offer insights on a range of topics related to wireless communications, high-speed computing and aerospace and defense systems. The design track explores the latest circuit and component design techniques and architectures with examples of key active and passive devices found in radio front-ends and transceivers for WiFi, small cell, 3G and LTE base-stations, backhaul networks, radars, etc. The measurements and modeling track looks at the tools and techniques used in support of virtual prototyping and design verification. The systems engineering track looks at various wireless systems and standards, receiver architectures, modulation techniques, etc., to provide broader overview of the networks driving component requirements and specifications. The commercial resources track provides a mix of vendor-based solutions and products for specific applications and engineering challenges.
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