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Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of two new Tflex™ series thermal gap fillers.
The Tflex™ SF800 and Tflex™ SF200 are the latest addition to Laird Technologies’ thermal gap filler line. The introduction of these two new products expands Laird Technologies’ silicone-free gap pad selection. Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features extremely low contact resistance for effective heat transfer. These products are naturally tacky on both sides and require no additional adhesive coating, allowing for exceptional thermal performance.
Both the Tflex SF800 and Tflex SF200 are offered in a variety of thicknesses to suit virtually any need. The SF800 has thermal conductivity of 7.9 W/mK, while the SF200 offers thermal conductivity of 1.8 or 2.0 W/mK, depending on thickness. These silicone-free gap pads are easy to handle in all available thicknesses while their natural tack allows for the pad to be held in place during assembly. Tflex SF200 is available with differential tack for easy assembly and rework.
“These new products are not only great solutions for silicone sensitive applications, but they are also effective in applications where silicone pads are traditionally used,” said Jane Lacy, Laird Technologies product manager. “They are ideal for a variety of applications including automotive, consumer products, medical devices and laser equipment.”
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.