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DesignCon 2013 announces conference program and keynote speakers

November 12, 2012
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Recognized throughout the semiconductor and electronic design industries as the premiere annual trade event, DesignCon 2013 is scheduled for January 28-31 in Santa Clara, Calif.  Hosted by UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 100 in-depth tutorials, technical paper sessions and panel discussions. Additionally, the two-day DesignCon expo program will debut with visionary keynote presentations, a progressive educational forum staged by DesignCon 2013 host sponsor, Agilent Technologies, and an expanded focus on training sessions, teardowns and technology solutions.

“With its unwavering focus on intensive technical education and networking, DesignCon is the definitive annual event for the chip, board and systems design community,” said Patrick Mannion, Content Director at UBM Electronics. “DesignCon is the largest annual meeting of board designers, and is the best face-to-face opportunity to scale know-how about chip, system and package design challenges.” 

DesignCon’s opening day keynote address will be delivered by Bill Swift, Vice President of Engineering at Cisco Systems, who leads silicon development engineering for the service provider, enterprise and high-end switching-based products. Jonah Alben, Senior Vice President of Engineering at NVIDIA, will keynote on the second day, Tuesday, Jan. 29.  Mr. Alben currently leads the development of next-generation GPU architectures. On Wednesday, Jan. 30, Mike Santori, Business and Technology Fellow at National Instruments will give the keynote address.

DesignCon 2013 will feature more than 100 tutorials and technical paper sessions focused on the pervasive nature of signal integrity at all levels of electronic design. Consequently, all presentations will be categorized under one of the following 14 conference tracks so that attendees may easily identify which sessions best suit their interests and are most likely to help further their career goals. Conference tracks for DesignCon 2013 include:

  • Chip-level design for signal and power integrity;
  • Analog, mixed-signal and RF design and verification;
  • Designing with programmable architectures;
  • System co-design: chip, package and board;
  • PCB materials, processing and characterization;
  • PCB design tools and methodologies;
  • Parallel and memory interface design;
  • High-speed serial design;
  • Jitter, crosstalk and noise analysis;
  • High-speed signal processing, equalization and coding;
  • Power integrity and power distribution network design;
  • Electromagnetic compatibility and interference;
  • Test and measurement methodology;
  • Signal propagation analysis techniques.

Additionally, the DesignCon 2013 expo will feature more than 130 exhibitors – more than any other design engineering event this season – as well as visionary keynote speakers from Cisco, NVIDIA, National Instruments and other influential companies; panel discussions; an educational forum sponsored by Agilent Technologies; and the ever-popular Chiphead Theater, which will host several live product teardowns and speed training demonstrations. 

Additional information and resources are available at http://www.designcon.com, on Facebook and on Twitter. 

Early Bird Pricing for the conference, which provides registrants with $250 in savings, extends from Saturday, Nov. 10, to Friday, Dec. 7, 2012. 

Participants can register now by visiting https://designcon.reg.ubmelectronics.com/2013 or by calling 888-234-9476 Monday through Friday between 9:00 a.m. and 4:00 p.m. PST.  For alumni and student rates, as well as press and media registration information, please contact Kate Hadden at kate.hadden@ubm.com.  Additionally, DesignCon 2013 exhibition space can be reserved by contacting Sean Raman at sean.raman@ubm.com or by calling 415-947-6622.  

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