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Cellular 4G/LTE Channel / Industry News

TI expands its Bluetooth wireless connectivity portfolio with QFN packages, module designs, new software

October 25, 2012
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Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools. The QFN packages and various modules give customers choice regarding power, size and cost requirements. For more information, visit www.ti.com/bluetoothqfn-pr.

QFN packages and kits

The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available today through TI and its distributors. To further help design efforts, TI encourages customers to download from its wiki a two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications.

TI will release full-featured evaluation boards and design materials for hardware and software prototyping with the CC2560 and CC2564 QFN devices later this quarter.

Production-ready modules and kits

In addition to the two modules previously announced, four new complete, validated and certified modules are now available from TI partners. The modules vary in size, temperature range and output power—including Class 1 and Class 2 versions. One module also offers a pre-integrated MCU plus CC2564 solution for faster development.

Software development kits for Bluetooth and Bluetooth/Bluetooth low energy solutions are currently available. Customers can also access sample applications and demos provided in source code showing API usage.

Software for QFN devices and modules

A royalty-free Bluetooth stack and various profiles are provided pre-integrated on MCUs such as TI’s ultra-low power MSP430 MCU and Stellaris® ARM® Cortex-M3/M4 MCUs. 

TI will also release an updated Bluetooth stack in mid-4Q 2012. The new stack will offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimization and the ability to support a broader range of MCUs.

Complete information including getting started guides, documentation and support for all CC2560 and CC2564 solutions can be found at www.ti.com/connectivitywiki.

Features and benefits of the CC2560 and CC2564 portfolio

The CC2560 device offers Bluetooth v4.0 “classic” support for audio and data applications requiring high throughput. The CC2564 device supports two options: dual-mode Bluetooth/Bluetooth low energy or dual-mode Bluetooth/ANT+. Applications that benefit from the dual-mode solution include those that require wireless communication to Bluetooth “classic” products and Bluetooth low energy or ANT+ devices such as sports and fitness aggregator gadgets or smart watches. The dual-mode Bluetooth v4.0 solution can also be used as a sensor solution that delivers longer range to communicate with mobile devices that may or may not have Bluetooth low energy technology.

Features

Benefits

•       Bluetoothv4.0 support (Bluetooth and Bluetooth low energy dual-mode)

•       Best-in-class Bluetooth RF performance

•       TI’s proven 7th generation Bluetooth technology

•       2x range over competitive Bluetooth low energy solutions

•       Robust, high throughput wireless connecitivity with extended range and power efficiency

•       Royalty-free Bluetooth software stack offered from TI and developed by Stonestreet One

–        Supports various  microcontrollers such as TI’s MSP430 and Stellaris MCUs

•       Simplified and minimized hardware and software development for quick time-to-market

•       Allows for extensive application prototyping and development

Availability and pricing

The QFN solutions are available today on the TI eStore and through authorized TI distributors:

Device

Part

Size

Price

CC2560 (QFN)

CC2560ARVMR

CC2560ARVMT

Device: 7.83 x 8.10 mm

Design: 16.5x16.5 mm

$1.86 for 1K units

CC2564 (QFN)

CC2564ARVMR

CC2564ARVMT

Device: 7.83 x 8.10 mm

Design: 16.5x16.5 mm

$2.14 for 1K units

More details on TI’s QFN solution including design guide, testing guide, datasheet, software download and a Bluetooth hardware evaluation tool can be found here.

Production-ready Bluetooth classic and dual-mode modules from TI partners include:

Partner

TI device

Part number

Product page

Panasonic

CC2560

PAN1325A/15A

http://www.panasonic.com/industrial/electronic-components/rf-modules/bluetooth/pan1325a-1315a.aspx

Panasonic

CC2564

PAN1326/16

http://www.panasonic.com/industrial/electronic-components/rf-modules/bluetooth/pan1326-1316.aspx

Murata

CC2560

SN2100 (Class 1)

http://www.murata-ws.com/sn2100.htm

Murata

CC2564

LBMA1BGUG2 (Class 2)

http://www.murata-ws.com/type-ug.htm

LS Research

CC2564

450-0104

http://www.lsr.com/wireless-products/tiwi-ub2

BlueRadios, Inc.

CC2564 +
MSP430F5438

BR-LE4.0-D2A

http://www.blueradios.com/hardware_LE4.0-D2.htm

More details on the above modules can be found here.

Find out more about TI’s wireless connectivity solutions

Recent Articles by Texas Instruments Inc.

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