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Rogers to showcase high performance printed circuit board materials at EuMW 2012

October 19, 2012
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Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012. Representatives from Rogers Corp. (www.rogerscorp.com) will be available at both the EuMC exhibition and the EuMC’s Microwave Application Seminars (MicroApps), offering practical guidance on the optimal use of their high performance printed circuit board (PCB) materials.

As part of the EuMC exhibition, Rogers (booth #525) joins more than 250 exhibiting companies as part of Europe’s largest annual RF/microwave exhibition event. At Rogers’ booth, visitors can learn more about a wide range of high-performance circuit materials, including RT/duroid® 6035HTC laminates and 2929 bondply material. RT/duroid 6035HTC laminates are ceramic-filled PTFE composite materials well suited for high power RF and microwave applications, including in couplers, filters, power dividers/combiners, and power amplifiers. These high performance materials incorporate a unique filler material to achieve a relative dielectric constant of 3.5 in the z-axis at 10 GHz with extremely high thermal conductivity of 1.44 W/m-K. The high thermal conductivity, combined with a low loss tangent of 0.0013 at 10 GHz, enables circuit designers to optimize gain and efficiency in high-power amplifiers.

Rogers’ 2929 bondply material is an unreinforced thermoset resin based thin film adhesive system for constructing multilayer circuits. This is a low loss circuit adhesive, with a dielectric constant of 2.94 in the z-axis at 10 GHz and loss tangent of less than 0.003 in the z-axis at 10 GHz. The 2929 bondply materials are based on a proprietary cross-linking resin system and compatible with sequential bond processing techniques. They are also ideal for creating multilayer circuits with many of Rogers’ high performance PCB materials, including RO3000® and RO4000® laminates.

Rogers’ experienced technical presenters will offer two talks of interest to PCB designers, as part of the EuMC MicroApps sessions. In the first, scheduled for Tuesday, October 30 (16:00-16:30), John Coonrod will describe how rough copper surfaces on PCB materials can affect the performance of high frequency circuits, in “Varying Effects of Copper Surface Roughness on Different PCB Transmission Line Circuits.” John Coonrod, Rogers’ Market Development Engineer and author of the popular “ROG” blog series (www.rogerscorp.com/acm), has written many articles on circuit materials. In the second MicroApps presentation, scheduled for Wednesday, October 31 (12:00-12:30), Al Horn will advise how the choice of circuit laminate can impact heating effects in high power, high frequency circuits, in “Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates.” Al Horn, Rogers’ Associate Research Fellow, has also authored numerous articles on RF/microwave circuit materials.

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