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Industry News

Diodes added to SemiGen's RF Supply Center

October 4, 2012
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SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom. The RF Supply Center is now offering PIN and limiter diodes that meet the most common RF/Microwave design specifications. PIN diodes are available from 4 to 150 microns. Limiter diodes are available from 2 to 20 microns. Voltage ranges for each are from 15 to 1500 VDC. Capacitance ranges are 0.02 to 3.0 pF. Series resistance is from 0.5 to 3.0 ohms. These diodes have been passivated with either thermal oxide process for devices under 200 volts or via ceramic glass for higher voltage and power handling.

In addition, the RF Supply Center is also offering MNOS chip capacitors, mounting caps, and binary caps. These capacitors feature high insulation resistance, low dissipation factors, and low temperature coefficients. 50 and 100 Vdc options are available. Capacitances range from 0.2 pF to 1500 pF. To achieve optimal performance these silicon capacitors are manufactured using a base oxide layer capped with a protective nitride. Soft Gold bonding surfaces and solder friendly backside metal allow for easy assembly.

A final addition to the RF Supply Center are hard to find step recovery diodes offering capacitance ranges from @6 Vdc 0.2 to 3.0 pF. Discontinued by many suppliers, SemiGen has opted to stock these devices for customers servicing legacy RF and microwave systems. These SRD’s utilize controlled grown junction epitaxial silicon combined with a silicon dioxide passivation which ensures stability and reliability. These SRD’s feature low snap time throughout all voltage ranges from 8.0 to 120 Vdc.  

The center is also fully stocked with RF/Microwave bonding supplies electrically insulating and conductive pastes and films from Ablestik and Epoxy Technology, glob tops, damming material and encapsulants from Hysol, and gold wire, gold ribbon, and silicon-aluminum wire from semiconductor packaging materials.  Bonding tools include tungsten wire, unplugging probes, ball bond capillaries, waffle tacking tools, and a variety of wire and ribbon wedge tools from Gaiser/Coorstek. Custom laser cut epoxy preforms from Laser Services are also available. 

No minimum order is required on standard supplies. Custom orders accepted on diodes.

To learn more, visit: www.semigen.net.

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