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Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.
On the exhibition floor, visitors to Rogers’ Booth #101 are invited to find out how halogen-free Theta® circuit materials can improve the performance of their high-speed digital circuits. These RoHS-compliant, laminate and prepreg products exhibit minimal conductor and dielectric losses, helping circuit designers to achieve excellent signal-integrity (SI) performance in high-speed digital designs. Theta laminates feature a relative dielectric constant of 3.90 in the z-axis at 1 GHz, with a dissipation factor of only 0.009 at the same frequency. They deliver high reliability, thanks to a z-axis coefficient of thermal expansion (CTE) of only 50 ppm/°C, or about 30 percent lower than standard FR-4 circuit materials. This translates into improved reliability of plated through holes (PTHs), buried blind viaholes, and stacked viaholes in multilayer structures requiring multiple lamination cycles. With a high glass transition temperature (Tg), Theta materials are suitable for high-yield, lead-free processing.
Visitors to the Rogers’ booth can also learn about their new 2929 bondply material. This unreinforced thermoset resin-based thin-film adhesive system is ideal for reliable, multilayer circuit constructions. It has a low dielectric constant of 2.94 in the z-axis at 10 GHz, with a low loss tangent of less than 0.003 also in the z-axis at 10 GHz. Well-suited for creating multilayer circuit boards with many of Rogers’ high-performance composite dielectric materials, including Rogers RT/duroid® 6000, RO4000®, and RO3000® series laminates, 2929 bondply materials are based on a proprietary cross-linking resin system that makes the adhesive system compatible with sequential bond processing techniques.
As part of the PCB West 2012 Conference & Exhibition’s free Wednesday technical sessions, Rogers Market Development Engineer, John Coonrod, will present an “Overview and Comparison of Microwave PCB Transmission Line Circuits,” for PCB designers and engineers at all levels. Scheduled for September 26 from 11 AM to noon, the presentation will cover the basic transmission-line structures used in microwave circuits, including microstrip, stripline, and coplanar waveguide (CPW), and how improved knowledge of these circuit structures can even aid designers of high-speed digital circuits. Coonrod, author of the popular “ROG” blog series (www.rogerscorp.com/acm) will explore the capabilities of each circuit structure in terms of loss and propagation characteristics, and will compare data with the performance limits for each circuit type.
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