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Industry News

Hesse & Knipps to demo new 3 mil wire bonding capability at IMAPS 2012

August 17, 2012
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Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210. IMAPS 2012 is scheduled for September 9–13, 2012 at the San Diego Town & Country Convention Center inSan Diego, California, USA.  

Addressing the worldwide increase in demand for 3 mil wire, Hesse & Knipps enhanced the capabilities of its BJ935 Heavy Wire Bonder to process gold, aluminum and copper bonding wire with diameters from as small as 3 mil up to 20 mil (75 μm up to 500 μm).

“This new 3 mil capability has been in development over the last few months,” notes Joseph S. Bubel, president of Hesse & Knipps, Inc. “The Hesse & KnippsBJ935 is the only heavy wire bonder on the market to handle wire diameters in the 3 mil range.”

In addition to the new 3 mil heavy wire bonding capability, the BONDJET BJ935 offers ribbon bonding from 0.075 mm x 0.75 mm up to 0.3 mm x 2 mm on the same platform, plus both active and passive wire cutting. The new active slim wire cutter has been adapted for fine pitch and ensures increased cutter life and yield improvement compared to passive cutting. The slim active wire cutter enables precise, repeatable positioning and programmable depth of the cutter and better access into dense, complex wire-bonded packages since it does not require a pusher. The new “air cut” passive cutting option offers touch-free front-cutting for use on highly sensitive chip surfaces.

For more information about the Hesse & Knipps BONDJET BJ935 Heavy Wire Bonder and the company’s other wire bonder models, please visit the company’s website at www.hesse-knipps.com; to view videos of wedge bonding equipment in action, visit www.wirebonddemo.com.

For more information about the International Microwave Symposium, please refer to http://www.imaps.org/imaps2012/

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