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Software/EDA Channel / Industry News

Major update to Remcom's XF7 to be previewed at IMS

May 24, 2012
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This release of XF7 contains an assortment of new computational and complex geometric modeling features, such as leveraging XStream® GPU Acceleration for simulations with dispersive materials and the ability to twist and stretch geometry. Here is a list of highlights for the release:

Debye/Drude Dispersive Materials Leverage XStream GPU Acceleration
Simulations using Debye/Drude materials now join those using non-dispersive materials in leveraging XStream GPU Acceleration to dramatically reduce simulation time.

New Modeling Features: Stretch and Twist Geometries
Stretch and Twist created within XF7 or imported from other CAD tools.

Components Specified as RLC Values vs. Frequency
The sampled RLC facilitates modeling narrow band behavior of passive components. This feature can simulate the complex behavior of real world components using sampled values of equivalent circuits at different frequencies obtained from spec sheets.

Updated SAR Averaging to Comply with IEEE 1528.1
Recent changes to the IEEE 1528.1 standard call for more stringent mass accuracy in the averaging volume and the way unused voxels are handled.

Plane Wave Excitation with Active Feeds
Plane wave excitation may now be used in conjunction with active sources, making it easier to determine how external signals affect the operation of a device.

Coming Summer 2012:

  • Waveguide Ports
  • Stretch, Twist, and Bend Geometry
  • Static solver will solve for all good conductors
  • Improved accuracy of static solver when utilizing meshes with variable grid spacing
  • The voltages for conductors not assigned a specific voltage will now be computed (i.e. 'floating')
  • Simulations using Periodic Boundary Conditions and those using Thin Wire and Magnetized Ferrite materials will now take advantage of XStream GPU Acceleration
  • Birdcage Designer and MR Phased Array Designer automate or simplify several aspects of project creation, enabling simulation readiness within seconds
  • Simulated MR images
  • SNR and noise maps
  • B+/B- Fields

Other Recent Updates:

General:

  • Time Domain Reflectometry (TDR) and Time Domain Transmission (TDT) output types for signal integrity applications
  • Group Delay output type for analyzing distortion data during device design
  • Materials database included with the XFdtd installation
  • Ability to edit a Material's Notes
  • Improved and more automatic convergence control via new options for the Termination Criteria of simulations

Ease-of-Use improvements:

  • Automatic time domain sampling of results based on Frequency Range of Interest
  • Visualization of manual Fixed Points
  • Additional context menu items allow more direct access to commonly used functionality (like editing Features)
  • Simplified sampling interval settings for Frequencies of Interest (DFT)
  • Direction of incidence of External Excitations is now rendered in the Geometry View, greatly aiding in correctly identifying and specifying the direction
  • XF Solver intelligently records which XStream devices are being used for simulations, allowing multiple simultaneous simulations on a single machine

New features for mobile device manufacturers:

  • Ability to combine SAR from multiple sources
  • Antenna diversity, including independent PDFs for E_phi and E_theta

New features for medical device manufacturers:

  • Scaling of voxel models, with options for Modify, Transform, and Scale
  • Import of ICRP, NICT and Virtual Population voxel models
  • Automatic assignment of correct biological materials to all imported voxel types
  • Improved SAR statistics reporting (mass, dissipated power, mean SAR over regions)

New features for optics and photonics:

  • Visualization and creation of Nanometer-scale geometry

Geometric Modeling Additions:

  • Enhanced tools for creating and manipulating primitive geometric shapes: Sphere, Cylinder, Cone, Cuboid, Torus, Pyramid, Prism, Frustum and Helix
  • Addition of ODB++ PCB import within the CAD Merge functionality, allowing retention of modifications to the PCB that were applied previously to avoid rework
  • Ability to easily remove extraneous geometry during ODB++ PCB import
  • When creating a Sheet Body from Faces, the faces will “remember” their source and change appropriately if the source changes
  • A new tool in the Sketcher copies edges created by the intersection of the sketching plane and existing geometry and adds them to the Sketch
  • Arbitrary cut-planes facilitate interaction with complex models. These cut-planes are tightly integrated with our advanced 2D Sketcher allowing snapping, measuring, and copying of cut geometry

Performance:

  • XStream acceleration for simulations with Time-dependent Materials
  • FDTD simulation can now leverage XStream functionality for spaces initialized by the static solver
  • Simulations using averaged materials now exploit XStream GPU acceleration technology
  • Performance of Broadband Far-Zone (previously known as Transient Far-Zone) computations have been dramatically improved
  • Additional efficiencies in CAD import, particularly for large models with many assemblies
  • Improved speed performance for loading very large projects
  • Improved performance for simulations with large amounts of steady-state field data

See more from us in our Buyers Guide directory listing.

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