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TE to display and demonstrate latest board level products and solutions at Avionics Europe

KEYWORDS avionics te

TE Connectivity (TE) is featuring the latest board level innovative products and solutions enabling open architecture, increased bandwidth and reduced SWaP at Avionics Europe this week, on 21-22 March, in Munich Germany. These advanced products and solutions will be on display at Booth B14:

  • Fortis Zd – This advanced high-speed backplane connector, designed for military and commercial aerospace applications, supports increasing bandwidth requirements in a ruggedized format to withstand the increased shock and vibration requirements of emerging military applications. 
  • VITA 67 RF Module –These modules enhance the ability to add RF capabilities in VITA 46 VPX board-to-board connections, which are compatible with VITA 65 OpenVPX specification. 
  • Future Unleashed Demo Box –The new demo box showcases the future of advanced packaging, an all in one package provides solutions for integrated wire cable and advanced connector applications.

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