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In Print

May 2013 Digital Edition Online Edition

Featured

From a Russian Source

Oscillator and synthesizer developments in Russia

Featured

The Premier of EDI CON

A look at an emerging community and its unique technology needs in a recap of EDI CON 2013

Featured

Efficiency Enhanced Amplifier Using a Digitally-Controlled Dynamic Bias Switching Circuit

The MWJ Buyer's Guide

Click this featured vendor's logo for the latest RF/microwave products, catalogs, brochures and company news.
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Popular

California receives first-ever white space broadband network

Cobham purchases Axell Wireless Ltd.

Disposable wireless heathcare sensor market shows signs of life

From a Russian Source

Richardson RFPD Announces IMS 2013 Schedule

Better than photos - Northrop Grumman, U.S. Navy conduct arrested landing of X-47B unmanned demonstrator

- Northrop Grumman, U.S. Navy conduct arrested landing of X-47B unmanned demonstrator

TPR1000 - SiC High Power Transistors for Next Generation VHF/UHF Radar

- Wireless Trends to Look for at MWC 2013

LTE and WSN - Wireless Sensor Networks: Overcoming the Challenges to Reach $2 B in 2021

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Home » Proper Stack-Up in a Multilayer PCB to Reduce Noise Coupling and Improve EMI
Software/EDA Channel

Proper Stack-Up in a Multilayer PCB to Reduce Noise Coupling and Improve EMI

Antonio Ciccomancini Scogna, CST of America, Framingham, MA; Jianmin Zhang, CISCO Systems, San Jose, CA
February 14, 2012
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Related Articles

Smart Design Practices Address EMI/EMC Challenges

A New Class of Asymmetrical Directional Couplers for Power/Antenna Control Applications

CST PCB STUDIO

Investigates the effect of noise propagation in a multilayer PCB, due to the close proximity of two PWR planes and provides an overview on the design of the power bus location on multilayer PCBs

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