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Rogers to showcase power electronics products at APEC 2012
Rogers Corp., represented by its Power Electronics Solutions (PES) Business Group, will showcase some of its more popular products for power electronics applications at the upcoming APEC 2012 conference and exhibition.
APEC 2012, the Applied Power Electronics Conference, is the leading event for practical and applied power electronics engineering. It is scheduled for February 5-9, 2012, at the Disney Coronado Springs Resort in Orlando, Fla. The new Rogers PES Group consists of Power Distribution Systems (PDS) and curamik® units; both will feature their high-performance power electronics products at APEC 2012, Booths 1009/1011.
Rogers PDS is launching new technology at APEC 2012 with RO-LINX® PowerCircuit™ busbars, which provide multifunction capability in a single, compact form factor. PowerCircuit busbars can distribute power and signal lines or have components mounted on the busbar structures—saving space and weight. These three-dimensional (3D) capable structures are ideal for a wide range of power distribution applications in EV/HEVs, wind/solar power and variable-frequency-drive (VFD) markets.
PowerCircuit busbars are solder-process compatible, and the highly integrated structures help engineers in the design of power and control circuitry while maintaining small circuit footprints. In addition, PDS will demonstrate the benefits of their industry-standard RO-LINX series of laminated busbars, known for reliable long performance and safety in demanding applications. RO-LINX busbars provide engineers with elegant solutions in a variety of markets, including mass transit and electric propulsion, industrial drives, renewable energy and defense/aerospace markets.
Rogers curamik business unit will provide details on their direct bond copper (DBC) ceramic substrates and micro-channel coolers. DBC substrates deliver outstanding voltage isolation, high thermal conductivity and excellent heat-spreading characteristics for a wide range of power electronics applications, including power modules (such as motor drives and uninterruptible power supplies), automotive (x-by-wire, HEVs, EVs) and renewable energy (solar, wind). The high-performance substrates are made by bonding a bare copper layer with high heat capacity to different ceramics such as alumina (Al2O3) and aluminum nitride (AlN). Because DBC substrates feature temperature coefficients of thermal expansion closely matched to that of silicon, they support chip-on-board assembly while minimizing stress on silicon devices.
Representatives from curamik will also offer advice on the optimal use of their micro-channel coolers. Leveraging DBC technology in the form of customer-specific micro-channel structures, these coolers can achieve four times more efficient cooling than traditional module structures with liquid cooling.