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L-com to exhibit at DesignCon 2012
L-com Inc., a designer and manufacturer of wired and wireless connectivity products, has announced that it will be exhibiting at DesignCon 2012 in Santa Clara, Calif., from January 31st through February 1st. L-com's booth will be number 839 in the Santa Clara Convention Center.
DesignCon is the premier conference for engineers who design high-speed OEM products. The show, which has been occurring annually for the past 15 years, addresses critical issues around RF and signal integrity, verification tools, high-speed serial design and many other relevant topics. This is L-com's first participation in the event, which attracts exhibitors such as Agilent, Amphenol, Molex, Huber + Suhner, Siemon, Samtec and TE Electronics.
L-com will be showcasing many of its connectivity products, including its new Category 6 right-angle cables for tight-space applications. The company's booth will be staffed by industry experts to answer questions about L-com's high-speed cables and connectors and their quick-turn custom product capabilities.
"L-com offers a broad selection of unique connectivity products that are available off-the-shelf to quickly meet your product development and production needs," said Earle Durham, Chief Revenue Officer. "We also have the ability to provide quick-turn custom solutions as required from our USA and China manufacturing facilities."
Keynote addresses at DesignCon 2012 include AMD's corporate vice president and CTO, Joe Macri, Microsoft's CVP of Hardware and Technology, Ilan Spillinger, and Hewlett Packard's SVP of Research, Prith Banerjee. The conference offers 14 industry tracks with almost 120 sessions total.