TriQuint’s Full Line-Up of Integrated Modules Enables Remote Radio Heads
HILLSBORO, OREGON (USA) & PARIS, FRANCE – September 20, 2010 – TriQuint Semiconductor (NASDAQ: TQNT), a leading RF products manufacturer and foundry services provider, will showcase an extensive portfolio of integrated RF products for base transceiver station (BTS) radios at the European Microwave Conference. TriQuint products reduce the size and complexity of RF circuitry by integrating multiple functions into modules. This enables migration to smaller, more ‘green’ remote radio head (RRH) base stations, a plan network operators are deploying to expand networks for 3G / 4G smartphones and other mobile devices.
TriQuint’s new base station modules offer designers four levels of RF integration to reduce board space, lower bill of materials, and improve efficiency. Level 1 TriQuint solutions include high gain products that can replace one or more discrete components with a single module. At the highest level of integration, TriQuint’s new Level 4 modules such as the TQM879006, replace multiple discrete products with one module that incorporates two amplifiers, a digital step attenuator and all input/output matching circuitry.
“Global mobile networks are transitioning to base stations that use remote radio head designs. TriQuint’s newest products simplify RF connectivity in these systems. TriQuint devices enable manufacturers to focus on competitive system performance instead of dedicating valuable resources toward RF component matching issues,” said Brian P. Balut, TriQuint Vice President.
Huawei Networks touts the benefits of remote radio head designs in both trial and operational systems. In work with international mobile operator Vodaphone, Huawei notes in an article entitled, “Network Deployment; it’s all in the mind,” that the cost savings from increased efficiency in the links between the base station and the rest of the network are very significant. Remote radio head innovations are central to moving all key radio components closer to the antenna while reducing the size of radio housings; these advances reduce power consumption directly and through lower overall thermal mitigation requirements.
TriQuint base station customers including Samsung Electronics have benefitted from the space-saving and cost reduction benefits of integrated components. “We appreciate the quality of TriQuint’s AH212 and AH420. These devices have enabled us to develop high power amplifiers for new LTE base station systems. The support we receive from TriQuint has helped us satisfy customer demands,” said Samsung Electronics RF Core Lab Senior Engineer, Jong-Hyun Lee.
Leading base station repeater manufacturer SK-Telesys also recognizes the benefits of TriQuint components in their WCDMA and CDMA systems. “Our experience with TriQuint’s products including the AH212, AH225 and the ML485 has been very good. These devices enabled us to develop new repeater systems. Engineering and product support from TriQuint have been important for us in meeting customer deadlines and requirements,” said SK-Telesys Access R&D Senior Engineer, Chul Lee. TriQuint products are used by major OEM base station radio manufacturers across Europe, Asia and North America in WCDMA, CDMA, MC-GSM and LTE networks. TriQuint’s newest, fully-integrated base station module, the TQM879006, is being released in conjunction with the 40th Annual European Microwave Conference, in Paris, France (28-30 September 2010); visit TriQuint at Stand 60.
TriQuint offers integrated pre-driver and driver RFIC base station solutions designed to improve efficiency, reduce the PCB area dedicated to RF and reduce remote radio head bill of materials. TriQuint’s base station portfolio includes gain blocks, switches, mixers, low noise and driver amplifiers, converters, SAW filters and integrated modules.
TriQuint’s Pre-Driver and Driver Integrated Products
• Level 1 - Devices that offer higher gain than discrete components and integrated matching. This eliminates one or more components in base station amplifier line-ups for size and overall cost savings. Example: TQP3M9008, TQP3M9009
• Level 2 - Devices that integrate multiple functions in a package such as a multi-stage amplifier or mixer and an LO buffer amplifier for reduced system size. Example: TQP8M9013, ML483, ML485
• Level 3 - Devices that combine two complete amplifier stages and interstage matching. These products eliminate the need for matching circuits between amplifiers while reducing costs and circuit size. Example: AH212, AH323
• Level 4 - Full integration at 50 Ohm input/output impedance. Multiple functions incorporated into a package such as two amplifiers, a digital step attenuator, all bias chokes as well as bypass and blocking capacitors that yields a simpler, more compact solution for lower overall costs. Example: TQM879006
For more information about TriQuint’s new base station products, point-to-point microwave, optical networks, defense/aerospace, foundry and mobile device solutions, contact TriQuint Product Marketing or visit us on-line by clicking the link below our logo on this page. For information about future product releases and to subscribe to our newsletter, visit www.triquint.com/rf.