Rogers Corporation showcases three of its groundbreaking advanced materials for microelectronics packaging at this year’s International Microelectronics and Packaging Society (IMAPS) Device Packaging 2010 event (March 9-10, 2010, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ).
Rogers Advanced Circuit Materials (ACM) Division employees will be at the show in full force, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.
IMAPS (www.imaps.org) is an organization devoted to the growth and advancement of microelectronics and packaging technologies, and Rogers’ advanced electronic materials support the design of both high-performance microelectronic circuits and packages. For example:
Rogers RO2808 fluoropolymer composite circuit laminates consist of thin dielectric layers with high dielectric constant (typically 7.6 at 10 GHz) and low dissipation factor to minimize dielectric signal losses. These circuit materials are available with a low-profile copper thickness option in support of miniature, high-density package designs. A ceramic filler system improves dimensional stability compared to woven-glass-reinforced materials, while excellent electrical stability makes RO2808 laminates suitable low-cost replacements for low-temperature-cofired-ceramic (LTCC) circuits and packaging.
Rogers ULTRALAM 3000 laminates and bondply materials feature low and stable dielectric constant (typically 2.9 for ULTRALAM 3850 laminate) with low dissipation factor. These halogen-free, liquid-crystal-polymer (LCP) materials are engineered for single and multi-layer high-speed and high-frequency circuits where dimensional stability must be tightly controlled. Ideal for use in computer network and telecommunications equipment where high reliability is critical, low-cost ULTRALAM 3000 materials support high-volume circuit-board production environments.
As an alternative to PTFE circuit materials, Rogers RO4000 glass-reinforced hydrocarbon/ceramic laminates deliver outstanding high-frequency performance even though they can be processed with the same low-cost methods used for epoxy/glass (FR-4) materials. Now available with a dielectric constant of 6.15 (RO4360 laminates), these laminates exhibit a low Z-axis coefficient of thermal expansion (CTE) for dependable plated-through-hole (PTH) quality in multi-layer circuit and package designs. RO4000 laminates also feature a high glass transition temperature (greater than +280ºC) and excellent thermal conductivity. Reduce design cycle costs by replacing green tape with Rogers’ new RO4360 laminate today.
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