Wafer Probes



The new 1MX Technology combines the |Z| Probe advantages of excellent contact quality and robustness with a higher bandwidth, lower insertion loss less than 0.8 dB at 67 GHz and higher isolation better than 40 dB in contact. The probe is optimized for 50 to 250 µm pitch and comes with a smaller contact footprint compared to the standard |Z| Probe types. This enables fine pitch testing with less over travel by keeping the lifespan of one million touchdowns.

See us in Booth 1118 at EuMW 2009 in Rome.

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