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Materials/Packages

Wafer Probes

January 17, 2011
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The new 1MX Technology combines the |Z| Probe advantages of excellent contact quality and robustness with a higher bandwidth, lower insertion loss less than 0.8 dB at 67 GHz and higher isolation better than 40 dB in contact. The probe is optimized for 50 to 250 ┬Ám pitch and comes with a smaller contact footprint compared to the standard |Z| Probe types. This enables fine pitch testing with less over travel by keeping the lifespan of one million touchdowns.

See us in Booth 1118 at EuMW 2009 in Rome.

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