Arlon’s EP2 (Enhanced Polyimide) represents a significant breakthrough in polyimide technology, using proprietary chemistry to provide a highly filled, dimensionally stabilized product with improved copper peel strength and higher thermal conductivity - at a reduction in cost that narrows the gap between pure polyimides and lower cost, but thermally inferior, multifunctional epoxies. This novel Arlon-developed (patent-pending) chemistry that enhances the bond of the polyimide resin to substrate glass, filler materials and copper is the enabling technology in this 4th generation polyimide product. Typical properties of this system include: Tg of 250°C, total Z-direction expansion (50 to 260°C) of under 0.75 percent, and lower electrical loss (0.006 to 0.008).

Visit us in Booth 315 at EuMW in Rome.