HMIC Broadband Surmount Switches

MA-COM Technology Solutions has developed a unique approach to the packaging and integration of ultra-wideband switches, such as the MASW-002103 (SPDT), MASW-003103 (SP3T), and MASW-004103 (SP4T) which deliver both superior RF and Thermal performance. Switches packaged using standard plastic packaging techniques continue to have upper frequency range limitations, as well as repeatability issues caused by die attach, and chip and wire assembly techniques.

M/A-COM Technology Solution’s HMIC technology utilizes semiconductor wafer-scale processes to realize repeatable broadband monolithic surface-mount devices.