advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
Antennas

HMIC Broadband Surmount Switches

January 17, 2011
/ Print / Reprints /
| Share More
/ Text Size+


HMIC Broadband Surmount Switches

MA-COM Technology Solutions has developed a unique approach to the packaging and integration of ultra-wideband switches, such as the MASW-002103 (SPDT), MASW-003103 (SP3T), and MASW-004103 (SP4T) which deliver both superior RF and Thermal performance. Switches packaged using standard plastic packaging techniques continue to have upper frequency range limitations, as well as repeatability issues caused by die attach, and chip and wire assembly techniques.

M/A-COM Technology Solution’s HMIC technology utilizes semiconductor wafer-scale processes to realize repeatable broadband monolithic surface-mount devices.

Post a comment to this article

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement