advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

fastRise™27 Multilayer Non-reinforced Prepreg

January 17, 2011
/ Print / Reprints /
| Share More
/ Text Size+
Designed to eliminate skew in differential transmission lines and eliminate Dk fluctuations caused by fiberglass in filter and coupler applications, fastRise™27 is a low temperature thermosetting prepreg based on ceramic, thermoset and PTFE. It is ideal for use with Taconic’s standard low loss laminates like TSM-29. The low 0.0017 Df @ 40 GHz enables the production of mm-Wave multilayer PWBs. The low 420F lamination temperature enables sequential laminations to be performed at lower temperatures than those normally used for FEP and PFA in military constructions.

fastRise™27 offers high performance in mm-Wave antenna, military, semiconductor test and other applications that require low loss at high frequencies. This fiberglass free, laser ablatable prepreg has a stable Dk over temperature and is a low temperature alternative to thermoplastic films in military designs. This materials also eliminates the need for low temperature melting PCTFE which has a high loss at mmWave frequencies. Due to fastRise™27’s low Dk, thickness of ATE printed circuit boards can be reduced.

Post a comment to this article

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement