CST Announces Joint Marketing Agreement with Cadence Design Systems
Nov. 30, 2010 - Computer Simulation Technology (CST) announces the signing of a joint marketing agreement with Cadence Design Systems
As world leaders in their respective fields of layout and 3D full wave simulation, Cadence and CST are collaborating in order to offer an effective workflow for PCB and package layout co-design in high-speed and mixed RF systems. Cadence and CST applications teams will be working together to address customer requirements and offering best in class solutions.
Chip Packages and PCBs work at very high speeds, often resulting in unwanted noise, reflections and crosstalk as well as other undesirable effects that can affect performance and energy consumption. Pre-layout analysis as well as post-layout verification of performance is required to ensure that the system meets specifications and that undesired effects are minimized while keeping the minimum cost. The Cadence/CST solution offers fully automated, but rigorous workflows employing 3D extraction. All critical nets, discontinuities and 3D components such as wirebonds and BGAs are accurately characterized. The combined solution builds great confidence in device performance even before the first prototype is built.
Two possible workflows are offered depending on the engineer’s expertise and interest. An “EM-centric approach” focuses on the full wave environment and allows complete access to the tool’s extensive pre- and post-processing capabilities as well as parameterization and optimization. Other electromagnetic studies could also be made; the effects of an enclosure, for example. Direct import of .brd, .mcm and .sip files is supported and all editing/selection is done in the full wave environment. “An EDA-centric approach” assumes expertise in the layout tool and allows the full wave simulation to be run as a fully automatic background process with back annotation of results to the layout environment. Meaningful and accurate 3D characterization data is generated but minimal knowledge of the full wave environment is required.
Jonathan Oakley, VP Sales & Marketing, CST of America, commented “Cadence and CST can together offer very effective solutions to high-speed package, system in package and PCB problems. The signing of a joint marketing agreement ensures a high level of commitment, ultimately benefitting the customer with greater expertise and more effective solutions on offer from both companies.”
“The Cadence Silicon Realization products combined with CST’s 3D full wave extraction aligns with the EDA360 vision to offer a uniquely powerful workflow solution,” commented Brad Griffin, Product Marketing Director, SiP, IC Packaging, and PCB High-Speed Solutions, Cadence Design Systems. “This agreement represents an opportunity for customers to benefit from the combined expertise of two recognized world leaders.”
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