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Rogers Shows Laminate/Prepreg System Solution at Electronics Midwest 2010

August 24, 2010
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Chandler, Arizona, August 00, 2010 - Rogers Corporation (NYSE: ROG) will be highlighting the benefits of its new 6.15 dielectric constant RO4360™ laminate and RO4460™ prepreg system at the upcoming Electronics Midwest 2010 exhibition (Donald E. Stephens Convention Center, Rosemont, IL, September 28-30, 2010). In addition, members of Rogers Advanced Circuit Materials (ACM) Division will be on hand in booth# 7913 to offer suggestions on the optimal use of their high speed digital Theta™ circuit board materials.

Electronics Midwest (www.ElectronicsMidwest.com ) is the largest electronic manufacturing trade show in the Midwestern United States.

Rogers’ new RO4360 thermoset laminate and RO4460 thermoset prepreg system offers the lowest total cost solution for fabricators of high frequency, multilayer circuits seeking to reduce circuit board size. The high dielectric constant of 6.15 for both materials allows designers to create circuits with dimensions that are as much as 30% smaller than lower dielectric constant materials. Rogers RO4360 laminate features a low dielectric loss of 0.003 at 2.5 GHz, a high thermal conductivity of 0.8 W/m-k, and is compatible with hybrid designs. This system is ideal for miniaturizing many high frequency circuits, including amplifiers and filters.

Rogers Theta materials are ideal for high speed digital applications requiring environmentally friendly, lead-free processing. These halogen-free materials feature a dielectric constant of 3.8 at 1 GHz and low loss, with a dissipation factor of 0.008 at 1 GHz. They exhibit a high glass transition temperature (Tg) of 180°C compatible with RoHS-compliant processing, and low z-axis coefficient of thermal expansion (CTE) for reliable plated-through-hole (PTH) performance in multilayer designs.

For more information visit the company’s website by clicking the link below our logo on this page.

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