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Passive Components / Software & CAD

Agilent Technologies’ Device Modeling Software Enables Successful Development of Hua Hong NEC’s RF Device Modeling Platform

June 11, 2010
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SANTA CLARA, Calif., June 11, 2010 -- Agilent Technologies Inc. (NYSE: A) today announced that China-based Shanghai Hua Hong NEC Electronics Company, Ltd. has successfully used Agilent’s Integrated Circuit Characterization and Analysis Program (IC-CAP) software to develop an RF device modeling platform for 0.35µm and 0.18µm RF semiconductor devices.

Hua Hong NEC developed its customized RF modeling platform using the advanced capabilities available in the IC-CAP software. One such capability, GUI Studio, allowed the company to directly generate well-documented, simplified and intuitive extraction routines that significantly cut time required for a complete modeling process. The resulting RF modeling platform included proprietary de-embedding, RF model extraction techniques, corner simulation setups, and a quality-assurance script. This approach enabled highly accurate modeling of HBTs, inductors, varactors and other 0.35µm and 0.18µm devices, and significantly reduced time-to-market.

Agilent’s IC-CAP platform is a flexible device-modeling program that delivers powerful characterization and analysis capabilities. The platform is ideal for today’s semiconductor modeling processes for DC and RF applications. IC-CAP provides efficient and accurate extraction of active device and circuit model parameters. The program performs numerous modeling tasks including instrument control, data acquisition, graphical analysis, simulation, and optimization. IC-CAP is used by semiconductor foundries and design houses to characterize foundry processes.

“The major software/platform technology enhancements implemented in the 2009 release of IC-CAP played a critical role in allowing us to develop a highly efficient, customized RF modeling platform,” said Xiangming Xu, director of modeling for Hua Hong NEC. “The software’s high level of customization, for example, provided us with the most efficient path to accurate model extraction. Such enhancements will ensure that we are equipped with the powerful and flexible device modeling platform we need to meet our needs for years to come.”

“As the industry standard for DC and RF semiconductor device modeling, IC-CAP provides today’s semiconductor foundries and IDMs with the most advanced, customizable modeling software for measurement, simulation, optimization and statistical analysis of semiconductor devices,” said Todd Cutler, marketing manager with Agilent’s EEsof EDA organization. “We are pleased that this flexible, easily customizable platform has enabled Hua Hong NEC to implement the strategies and techniques necessary to effectively meet its device modeling goals today and in the future.”

For more information about the IC-CAP software platform, go to www.agilent.com/find/eesof-iccap.

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