Rogers to roll out new HF materials & lead-free laminates at Radio & Wireless Symposium
Monday, January 05, 2009
Rogers CT – The Advanced Circuit Materials (ACM) Division of Rogers Corporation will be exhibiting its RT/duroid® high frequency materials and its RO3000 ® and RO4000 ® laminates at the upcoming IEEE Radio & Wireless Symposium in San Diego during Radio & Wireless Week, January 19-20, 2009.
Featured RT/duroid materials on hand at the Rogers' booth (#15) will be RT/duroid 5000 and RT/duroid 6002 as well as the newest addition to the RT/duroid family of high frequency materials – RT/duroid 6202PR for use in designing complex microwave structures such as antennas and multilayer circuits with interlayer connections.
RT/duroid 6202PR offers the same electrical and mechanical properties as RT/duroid 6202, in addition to enabling tight tolerance planar resistors (PR) when clad with resistive copper foils.
Other products on display will be Rogers' widely used commercial grade RO3000 and RO4000 laminates.