SANTA CLARA, Calif., and PLAINVIEW, NY -- Agilent Technologies Inc. (NYSE: A) and Aeroflex Microelectronic Solutions today announced a strategic alliance to deliver industry-leading RF and microwave components and Multi-Chip Module solutions for aerospace, satellite and military applications using Agilent's MMICs (Monolithic Microwave Integrated Circuit) .
"Agilent is fully committed to helping today's engineers create the best products for the aerospace and defense market by providing them with the components they need from early development through production," said Mark Pierpoint, vice president and general manager, Agilent. "This partnership with Aeroflex Microelectronic Solutions reinforces our commitment to the high-reliability market."
"Aeroflex packaging and test capabilities combined with Agilent's proprietary MMIC solutions will provide RF and microwave engineers solutions for complex high-reliability communication designs," said Tom Terlizzi, vice president and general manager, Aeroflex Microelectronic Solutions, Plainview. "This partnership demonstrates Aeroflex's continued commitment to provide industry leading solutions to the Aerospace, Satellite and Defense markets."
Aeroflex Microelectronic Solutions is a world leader in the design and manufacturing of high-reliability integrated circuits and packaging, motion control and motors, microwave and RF devices, components and subsystems for the aerospace, medical, industrial, fixed broadband, wireless/mobile, and test and measure markets. Our customer-focused approach brings flexibility, creativity and cost-effectiveness to the diverse markets we serve. www.aeroflex.com.
