Agilent Technologies' Test, Inspection Innovations Win Awards at Major Industry Tradeshows
SANTA CLARA, Calif., April 16, 2008 -- Agilent Technologies Inc. (NYSE: A) today announced that its recently introduced test and inspection innovations have won several industry awards at two major tradeshows in April: *The Agilent Medalist x6000 Automated X-ray Inspection solution won the SMT China magazine's 2nd SMT China VISION award for Inspection and Testing (AXI category) at Nepcon Shanghai 2008. Earlier this year, the Medalist x6000 won an honorable mention from Test and Measurement World magazine for its 2008 Best in Test awards. *Agilent's Network Parameter Measurement technology, part of the Medalist VTEP v2.0 Powered vectorless test suite, won the Electronic Manufacturing (EM) Asia Innovation award in the Test System/Equipment category, also at Nepcon Shanghai 2008. *Agilent's Cover-Extend technology, the latest limited-access solution to be added to the company's VTEP 2.0 Powered suite, was selected among the winners for the IPC Innovation Technology Center award at the APEX tradeshow in Las Vegas. The awards recognize what each of these leading industry publications and organization consider to be the most innovative technologies, applications, products and services in the market. "We are deeply honored by the industry recognition for our innovations in the area of test and inspection," said NK Chari, director of marketing with Agilent's Measurement Systems Division. "Our vision is to continuously innovate and introduce the most complete suite of test and inspection solutions that will enable manufacturers to overcome their technology and business challenges." Additional Information The Agilent Medalist x6000 Automated X-ray Inspection system is the world's fastest 3-D inline AXI solution. It delivers reduced conversion costs, reduced capital expenditure and up to 95-percent defect coverage. For more information, please visit www.agilent.com/find/x6000. Agilent's Medalist VTEP v2.0 Powered vectorless test suite is the leading in-circuit test arsenal for manufacturers looking for a comprehensive suite of tools to overcome various limited access issues. It includes another award-winning technology -- iVTEP -- for testing ultrasmall packages, as well as Network Parameter Measurement and Cover-Extend. For more information, please visit www.agilent.com/see/vtep. Agilent also offers industry-leading automated solder paste and optical inspection solutions, such as next-generation optics, low-contrast component location, Solid Shape Modeling, and improved solder paste analysis algorithms. These capabilities help manufacturers deliver the highest coverage, speed and flexibility in the AOI industry. More information is available at www.agilent.com/find/aoi.