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Industry News / Subsystems and Systems

TI Introduces Sub-1 GHz Wireless Connectivity for Ultra-low-power MSP430 LaunchPad Development Kit

November 30, 2011
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Texas Instruments Inc. announced a sub-1 GHz radio frequency (RF) value line plug-in-board for TI’s MSP430™ microcontroller LaunchPad development kit. The new 430BOOST-CC110L RF BoosterPack includes ETSI-compliant and FCC-certified modules to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process. The RF BoosterPack and MSP430 LaunchPad offer developers affordable solutions for cost-sensitive sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The 430BOOST-CC110L is available for $19, and the MSP430 LaunchPad is separately available for $4.30.

“We are excited to bring wireless connectivity to the more than 100,000 MSP430 LaunchPads in the market today, and provide a simple, cost-effective development platform for those looking to innovate wireless products with MSP430 microcontrollers,” said Erling Simensen, Product Marketing Manager, Low-Power RF, TI. “By combining TI’s leading ultra-low-power MSP430 microcontrollers with our sub-1 GHz RF value line transceivers, we are delivering easy-to-use, affordable and scalable solutions to wirelessly connect more cost-sensitive consumer applications.”

Additionally, the RF module included on the RF BoosterPack is separately available as an ETSI-compliant and FCC-certified production-ready module. The A110LR09A RF module is available from TI third party developer Anaren Inc., and can be tested using the 430BOOST-CC110L development tool.


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