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Industry News

NXP Launches Medium Power Transistors in 2x2-mm Leadless DFN Package

November 21, 2011
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NXP Semiconductors N.V. announced the industry’s first medium power transistors in a 2 x 2 mm, 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) surface-mounted device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor.

Ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the new DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 Amps. When mounted on state-of-the-art 4-layer PCBs, its thermal performance matches much bigger standard SMD packages and allows Ptot levels of up to 1.1 W in a tiny footprint. Driven by miniaturization in chip design, NXP’s ultra-compact medium power transistors offer design engineers a flexible power transistor solution for designs focusing on space saving, energy efficiency, and low heat dissipation. All NXP medium power transistors are automotive-qualified according to AEC-Q101.

“With our latest miniaturized medium power transistor, we continue to drive the market in compact components and in high performance low VCEsat transistors. NXP is the first vendor to offer such a broadly differentiated choice of transistors in a tiny 2 x 2-mm 3-pin package, significantly expanding design options for engineers,” said Joachim Stange, product manager, NXP Semiconductors. “In charging circuits of mobile devices, tablet PCs and automotive electronics requiring smaller ICs, designers can now choose a medium power solution and not have to trade off PCB space for functionality. Simple applications, such as interior car lighting, which require only 1 to 2 W, can be powered by an ultra-compact medium power solution.”


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