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Industry News / Materials/Packages

Rogers to Show High Performance Circuit Materials and Offer Circuit-Design Insight

October 6, 2011
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Rogers Corp. Advanced Circuit Materials Division (ACMD) will display its high performance circuit-material solutions October 11-13 at the 2011 European Microwave Week exhibition in Manchester, UK. Rogers will also take part in the technical conference, as Rogers ACMD’s Market Development Engineer, John Coonrod, will shed light on how to improve the accuracy of computer-aided circuit simulations when using Rogers’ advanced circuit materials.

Attendees to the exhibition can stop by booth 118 to learn more about Rogers’ high performance circuit materials: RT/duroid® 5880LZ, RT/duroid 6202PR, and RT/duroid 6035HTC. Rogers’ RoHS-compliant RT/duroid 5880LZ circuit laminates are characterized by the industry’s lowest dielectric constant — 1.96 in the z-axis at 10 GHz. These materials offer extremely low loss, evidenced by a dissipation factor of typically 0.0019 at 10 GHz. Usable at satellite frequencies to Ku-Band and beyond, these RoHS-compliant circuit materials feature a low z-axis coefficient of thermal expansion (CTE) of 41.5 ppm/ºC for reliable plated through holes (PTHs) in multilayer circuits. RT/duroid 5880LZ is also light weight, having a specific gravity of 1.3 to 1.4, making it suitable for airborne satellite applications.

Rogers RT/duroid 6202PR laminates feature an in-plane expansion coefficient that is closely matched to copper for excellent dimensional stability. Available with different material thicknesses and copper weights, these low-loss materials have a low dissipation factor of typically 0.0020 at 10 GHz and are ideal for use in antennas, antenna arrays, and high-frequency multilayer circuits.

When designers need a circuit material for high-power, high-frequency circuits, such as power amplifiers and beam-forming networks, Rogers RT/duroid 6035HTC may be the answer. The high thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear versus some competitive offerings. The thermally stable material has a z-axis dielectric constant of 3.5 at 10 GHz, low loss by virtue of a loss tangent of 0.0013 at 10 GHz, and is available with reverse-treated, electrodeposited copper foil.

On October 11th at 12:00 P.M., Rogers’ John Coonrod will detail the importance of a circuit material’s relative dielectric constant at EuMC’s MicroApps session. His presentation “Understanding the Proper Dielectric Constant of High Frequency Laminates to be used for Circuit Modeling and Design,” explains the data-sheet values of relative dielectric constant for many high-frequency circuit materials may not lead to the most accurate performance predictions in RF/microwave software simulators, and what can be done about it.


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