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Industry News / Passive Components

Aspen to Exhibit Portfolio of Instruments and Components

September 23, 2011
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European Microwave Week 2011 provides an ideal showcase venue for Aspen Electronics, the UK-based distributor of test equipment, power supplies and specialist RF and microwave devices. Aspen will exhibit in booth 632.

Aspen’s extensive portfolio of instruments and components is set to attract considerable attention from the international audience attending this event in Manchester. Ideally suited to applications covering the design, development, production and test of RF and microwave equipment, subsystems and installations, the product range includes specialist instrumentation, as well as a wide range of components.

Of particular interest among the componentry on the Aspen stand is the range of high power chip terminations from Res-Net Microwave, a division of ETI (Electro Technik Industries). Manufactured in the US, the RPC250-250-4T50-5C offers excellent performance across the range from DC to 8 GHz.

With a low VSWR figure of 1.2:1, the high power chip termination handles 100 W, making it ideal for various applications in commercial and military frequency bands. The device is fully RoHS compliant and operates across the full -55° to 150°C temperature range.

Ask Aspen about Res-Net’s complete line of microwave attenuators, terminations, diode detectors, and resistors for the RF and microwave industries.

Also on show will be a series of high performance oven-controlled crystal oscillators (OCXO) from KVG Quartz Crystal Technology. The O.60.802658-LF device, for example, is a 100 MHz high performance device offering low phase noise (LPN), low G sensitivity (LGS) and tight frequency stability down to ±50ppb (-20° to +70°C). The OCXOs feature low power consumption and fast warm up time.

Applications are envisaged in instrument reference devices, clock references for microwave signal sources, microwave and telecom systems, radar equipment as well as test and measurement instrumentation.

The part is contained in a small sized surface mount package (25.4 x 22 mm with 13.2 mm profile) and is supplied taped on reels, ideal for high volume automatic pick & place machine assembly. The devices are fully RoHS compliant, supporting lead-free reflow solder temperatures.


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