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Epic Communications has developed a series of its next generation W-CDMA/HSPA power amplifiers (PA) that are specifically designed for 3G portable devices and mobile phones, and are compatible with industry leading 3G chipset solutions. This latest series of W-CDMA/HSPA PAs are designed specifically for the most popular UMTS/W-CDMA frequency bands (Bands I, II, V and VIII). They feature high linearity, high power added efficiency, ultra-low quiescent current, excellent temperature stability and very attractive performance/cost ratio. Epicom’s PAs are provided in 3 × 3 mm packages with the same dimensions, pin-out assignments and features as other major suppliers, and are compatible with the next generation 3G PA standards.
Based on the most advanced BiFET wafer process, all key features and functional blocks of Epicom’s 3G PA are integrated into a single cost-effective chip while still delivering superior performance. Epicom’s 3G PAs feature digitally controlled tri-power mode operation and ultra-low quiescent current. The compact package form factor includes both the required directional coupler and all matching circuits, and is fully compliant with next generation 3G/4G PA footprint, feature and performance requirements.
EPA8100A, EPA8200A, EPA8500A and EPA8800A are W-CDMA/HSPA PA products that support the most popular 3G bands: EPA8100A for Band 1 (1,920 to 1,980 MHz), EPA8200A for Band 2 (1,850 to 1,910 MHz), EPA8500A for Band 5 (824 to 849 MHz) and EPA8800A for Band 8 (880 to 915 MHz), respectively. The PAs are designed to operate from a single DC supply voltage ranging from 3.2 to 4.2 V. At a Vcc of +3.4 V, they achieve 35 to 40 percent power added efficiency at 28 dBm when operating in high-power mode, 30 percent in medium-power mode at 18 dBm and greater than 10 percent power added efficiency in low-power modes at 8 to 10 dBm. No external DC-DC converter is required since the built-in voltage regulators eliminate the need for any external reference voltage. The quiescent current is 10 mA when operating at low-power mode.
The PAs utilize Epicom’s patent pending temperature compensation design, which provides temperature stability from -40° to +85°C, allowing smart phones, wireless data cards and other 3G-equipped MIDs such as tablet PC and e-books to operate in extreme environmental conditions. These PAs are also provided as bare dies to volume SiP module makers for custom module design requirements. Epicom plans to offer more advanced PA products for other 3G standards such as TD-SCDMA, CDMA2000/EV-DO, and 4G standards of LTE and TD-LTE.
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