TriQuint Announces Next Generation PA Module for Qualcomm's 3G/4G Chipset
TriQuint Semiconductor Inc., a leading RF front-end product manufacturer and foundry services provider, announced availability of its first multi-mode power amplifier (MMPA) module developed for Qualcomm's 3G/4G chipset solution. The TQM7M9023, a member of the TRIUMF Module™ family, combines with TriQuint’s industry leading TRITIUM PA-Duplexer Module™ family to offer a complete RF system solution for smartphones and other mobile devices.
Tim Dunn, Vice President and General Manager of Mobile Devices at TriQuint noted, “The TQM7M9023 is an important addition to our product portfolio. It integrates W-CDMA functionality around our core competence of GSM/EDGE power amplifiers while providing customers a flexible, high performance platform solution to meet the increasing band count combinations in 3G/4G handsets. Our ability to integrate passive and active devices into high performance system solutions continues to propel TriQuint’s value in the smartphone market.”
TriQuint MMPAs provide several key benefits to mobile device vendors:
• Decreased overall radio solution size to enable a greater feature set in a smaller form factor
• Simplified PCB routing for improved performance and design cycles
• A reduction in BOM count that improves manufacturing efficiency
The combination of the MMPA and Band 2 and Band 5 TRITIUM modules offers a flexible and simplified RF solution that can reduce mobile device engineering and development time.
TriQuint offers the industry’s largest in-house technology portfolio that uniquely enables innovative RF architectures that align with major chipset providers; this broad breadth portfolio provides device manufacturers qualified, tested and certified solutions. TriQuint will highlight these platform solutions at the telecommunications industry’s largest annual gathering, GSMA Mobile World Congress, in Barcelona, Spain 14 - 17 February, 2011.