advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
Industry News

Multilayer Technology Enables Miniaturization of Integrated Multi-function Modules

February 2, 2011
/ Print / Reprints /
| Share More
/ Text Size+
The RF and microwave components market has seen the introduction of many new technologies over the years. In the early days, RF and microwave systems and subsystems were built using discrete single-function components, connected by semi-rigid or flexible cables. Each component was realized by the most suitable process and...
To view the full article, please register or login.

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement