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Industry News

Direct Plated Copper Metallized Substrate and Its Application on Microwave Circuits

A direct plated copper (DPC) metallized substrate technique is introduced and characterized in this article. The proposed DPC metallized substrate provides the main advantages of excellent thermal management and high-frequency characteristics, due to t...

October 9, 2010
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The direct plated copper (DPC) process on metallized ceramic substrate was originally created to replace the direct bonded copper (DBC) process because of its better electrical, thermal and mechanical performance. 1 Compared to DBC, DPC provides a very strong bond strength between the Al2O3/AlN substrate and the copper metal,...
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